1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

A big area of embedded system design are modules and there were plenty to see at this year’s embedded world conference. Modules support developers by helping reduce hardware design complexity, while ...

System-on-module (SOM) and system-in-package (SIP) solutions were out in force at this year’s Embedded World. These cost a bit more than trying to put comparable logic down on a printed circuit board ...

The MSRZG2UL and MSRZFive are system-in-packages (SiP) based on Renesas' single-core microprocessors, the RZ/G2UL and RZ/Five. The RZ/G2UL microprocessor includes a Cortex-A55 (1.0 GHz) CPU and a ...

We make researches on the fundamental technology on the dependable SoC (System-on-Chip) and SiP (System-in-Package) for embedded real-time systems to realize practical VLSI systems. To realize ...

At Embedded World North America, Octavo Systems co-founder Gene Frantz and CTO Erik Welsh discussed the company’s focus on system-in-package (SiP) technologies and their role in embedded systems.

Proponents of system-in-package (SIP) technology offer compelling arguments for the benefits of this approach to system-level design, chief among them the need for better time-to-market than that ...

At Embedded World today, Insight SiP, the specialist in ultra-miniature RF modules, is launching the ISP4520 series of modules, extending its product portfolio to include Long Range Networking via ...