Xanadu Quantum Technologies Ltd. ("Xanadu") (NASDAQ: XNDU) (TSX: XNDU), a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...

Xanadu Quantum Technologies and semiconductor equipment supplier EV Group (EVG) have announced a strategic partnership.

Xanadu Quantum Technologies, a Canadian photonic quantum computing company, and EV Group (EVG), a European supplier of wafer bonding and lithography equipment, have announced a pa ...

Metrology and wafer inspection processes are changing to keep up with evolving and new device applications. While fab floors still have plenty of OCD tools, ellipsometers, and CD-SEMs, new systems are ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...

Canadian quantum computing firm Xanadu has partnered with Austria-based EV Group to develop industrial-scale manufacturing processes for photonic quantum chips. The collaboration will use EVG’s wafer ...

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...

Fab processes are optimizing for cleanliness, planarity, and high bond quality. Nanotwinned copper and SiCN PVD enable lower anneal and deposition temperatures for HBM. A thin, protective layer helps ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...