The Manila Times

Introducing Automotive-Qualified System-in-Package Hybrid MCU for Automotive and E-Mobility Human-Machine Interface Applications

Microchip’s SAM9X75 hybrid MCU System-in-Package (SiP) enables MPU processing power with the familiar development environment ...
CNX Software

Microchip SAM9X75 Hybrid automotive MCU – Surprisingly ARM9 is still a thing in 2026

Microchip SAM9X75 hybrid automotive ARM9 MCU is a system-in-package with an ARM926EJ-S core and on-chip DDR2/DDR3L for HMI ...
Semiconductor Engineering

SiPs: The Best Things in Small Packages

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
Semiconductor Engineering

A Modular System In Package Approach For Automotive Short Range Radar Applications (Ruhr Univ. Bochum, Fraunhofer et al.)

A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, ...
EDN

GaN system-in-package targets USB-C PD adapters

Weltrend announced its first GaN-based system-in-package integrating an AC/DC controller and Transphorm’s 240-mΩ, 650-V SuperGaN FET. The WT7162RHUG24A is intended for USB Type- C Power Delivery (PD) ...