Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...

A research team affiliated with UNIST has reported a new simulation tool to better understand how liquid-phase chemical ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

The use of fiber-reinforced composites in Type 3, 4 and linerless Type 5 pressure vessels is growing, used to store compressed/renewable natural gas (CNG/RNG) and hydrogen as part of the global ...

Endoscopic submucosal dissection is a minimally invasive procedure used to treat early gastrointestinal cancers. However, it ...

One challenge faced by all control systems integrators (CSIs) is the prospect of testing their software before deployment. CSIs often work remotely, without having the actual equipment to manipulate, ...

Engineers working in the emerging areas of advanced air mobility (AAM) and electric vertical take-off and landing (eVTOL) may be in uncharted skies, literally and figuratively. While transforming ...

One of the biggest bottlenecks in the software development process for electronic products is that hardware is not available until late in the cycle. That means embedded software developers need to ...