RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio systems and solutions, today announced the introduction of its patent pending ...
PITTSBURGH--(BUSINESS WIRE)--PPG (NYSE:PPG) today announced the introduction of PPG TESLIN® EMI/RF (electromagnetic interference/radio-frequency) shielding material ...
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, ...
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