This strategic move integrates ASTER’s advanced "shift-left" design for test (DFT) functionality directly into Siemens' ...
Generative artificial intelligence (AI) represents the next great step forward in PCB design. This is, of course, what you might expect me to say. 2023 has been a year dominated by the rise of ...
Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
Courses are 3 credit hours each. Students must take all 5, for a total of 15 credit hours. ECEN 5224 High Speed Digital Design (Spring) ECEN 5514 Principles of EM for HSDE (Fall) ECEN 5524 Principles ...
The connection between mechanical and electrical concepts How to fit many components into a limited space. Proper communication is necessary when creating products in a team with diverse backgrounds.