Memory startup d-Matrix is claiming its 3D stacked memory will be up to 10x faster and run at up to 10x greater speeds than HBM. d-Matrix's 3D digital in-memory compute (3DIMC) technology is the ...
D-Matrix reveals plan to break through AI’s ‘memory wall’ with 3D DRAM-based chip architecture
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) today said it has started manufacturing the first commercial three-dimensional semiconductor device—a memory chip developed by privately held Matrix ...
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