CSP, driven by end-customer demand for portable handheld products, is exploding in use across the IC packaging industry. But the most utilized CSP package style emerging for 8-64 lead-count devices is ...

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...

Intersil discusses the benefits of using a leaded power module package like the ISL8225M versus non-leaded grid array packages found in the market today. Using power module makes designing a power ...

Nexperia has launched a 1,200V 30mΩ silicon carbide mosfet in a top-side-cooled plastic package with a 18.5 x 14mm footprint. The leaded package is 3.5mm thick is a SOT8107-2, according to the company ...

Nexperia has brought out a range of LED drivers in the DFN2020D-6 (SOT1118D) package. This case style features side-wettable flanks (SWF) which facilitate the use of AOI (automated optical inspection) ...

The growth of semiconductor content in automotive applications has been accelerating. This growth drives all families of semiconductor packaging in all regions. The growth is happening in the latest ...

As part of a global effort to save the environment, Intel Corp. and National Semiconductor have unveiled plans to become lead-free by the year’s end. While Intel will begin eliminating approximately ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...