What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

Toshiba Electronics Europe GmbH has launched the TB67S579FTG, a next-generation stepper motor driver IC featuring Advanced Microstep Technology. This two-phase, bipolar stepper motor driver utilises a ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...

Intelligent compaction (IC) technology represents a paradigm shift in pavement engineering by integrating advanced sensor systems, real‐time data processing and automated control to optimise ...

Wistron ITS (WITS), a subsidiary of the Wistron Group, has officially launched a new Semiconductor Business Unit, marking its strategic shift from traditional IT services toward integrated circuit (IC ...

Taiwan's Industrial Development Administration said it has approved 28 projects under its 2025 IC design subsidy program, selecting 33 companies for a combined NT$1.3 billion in government funding.