Heat-Spring® is a patented technology from Indium Corp. designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs® offer uniform thermal resistance at ...
As electronic chips get smaller and more powerful, they can overheat, reducing their reliability and lifespan. Overheating arises when phonons — quasiparticles that carry heat — become blocked at ...
The benefits of thermal interface materials. Comparing FR-4 laminate with insulated metal substrate (IMS) PCB. How phase-change TIMs may prove to be the best solution. One of the most important—and ...
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