Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

V-Chip, a subsidiary of Sai Microelectronic, has established a new IC design facility in Penang in September 2025.

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

This is a sponsored article brought to you by Siemens. In the world of electronics, integrated circuits (IC) chips are the unseen powerhouse behind progress. Every leap—whether it’s smarter phones, ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

Collectively, the startup’s founding team has 10 decades of experience in chip design, AI applications and product development at Texas Instruments, Qualcomm and other global companies, alongside 70 ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...