Based on the literature synthesis and system mapping presented in Section 2.4, a set of design requirements (DRs) was derived ...
Programmable material systems are emerging architectural structures but the co-design of structure, material, and external stimuli present grand challenges. A team with Northwestern Engineering’s Wei ...
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...
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