TEMPE, AZ--(Marketwire - Nov 7, 2012) - Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced the introduction of the new M-Series™ CSP ...
A remarkable development within the initial application is the use of M-Series fan-out technology to create a “protected fan-in WLCSP” where all the solder balls remain within the silicon area. Deca’s ...
KISSIMMEE, Fla. & TEMPE, Ariz.--(BUSINESS WIRE)-- SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner and Deca Technologies (Deca), a leading provider of advanced electronic ...
TEMPE, AZ--(Marketwired - Sep 1, 2016) - Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry, announced today the receipt of an additional $51.5 ...
Dublin, Feb. 27, 2020 (GLOBE NEWSWIRE) -- The "ASE/Deca M-Series Fan-Out Process" report has been added to ResearchAndMarkets.com's offering. This report includes a full investigation of the component ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, has licensed advanced packaging technology from Deca Technologies and has taken ...
The "ASE/Deca M-Series Fan-Out Process" report has been added to ResearchAndMarkets.com's offering. This report includes a full investigation of the component, featuring a detailed study of the PMIC ...
TEMPE, AZ--(Marketwire - Nov 7, 2012) - Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced the introduction of the new M-Series™ CSP ...
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