The global Glass Interposers Market is witnessing accelerated demand driven by the rapid evolution of advanced semiconductor packaging, rising adoption of heterogeneous integration, and increasing ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...