Domain-b

CAD and the art of complex machine design

3D CAD software offers critical time, cost, and quality benefits for machine designers, says Ved Narayan*, vice president, Asia Pacific, SolidWorks Corporation. Visualising product designs developed ...
Semiconductor Engineering

Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...
Machine Design

The future of CAD: driving revolution in 3D

We've witnessed dramatic advances in CAD usability, speed, graphics, “intelligence,” and automation over the past few years. But even the best 3D mechanical-design packages leave plenty of room for ...
Semiconductor Engineering

Thermo-Mechanical Stress On Active Chiplets In A 3D-IC Heterogeneous Package Assembly

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
Electronics Weekly

RS adds paid-for upgrades to free 3D mechanical design

RS Components has added to the capabilities of its free 3D mechanical design tool with two paid-for modules. RS said that the base-level DesignSpark Mechanical software which was developed with 3D ...