Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.
The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.
IEEE Spectrum on MSN
Low-vision programmers can now design 3D models independently
A11yShape lets blind coders design and verify models on their own ...
Spatial, which specializes in immersive design, today announced the release of Analogue 2, a next-generation collaborative design platform built natively for Apple Vision Pro. Developed from the ...
3D graphics design platform startup Spline Inc. said today it has closed on a $10 million funding, which coincides with the addition of Android support, opening up its collaborative capabilities to ...
Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...
Typical weigh scales provide one dimension of information, downward force. The MAXREFDES82# reference design provides both downward force and center of mass, by collecting responses from four load ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results